this is information on a product in full production. april 2014 docid18055 rev 3 1/10 HSP061-8M16 8-line esd protection for high speed lines datasheet - production data features ? ultralarge bandwidth: 6.3 ghz ? ultralow capacitance: 0.6 pf ? low time domain reflection ? low leakage current: 100 na at 25 c ? extended operating junction temperature range: -40 c to 150 c ? package size in mm: 3.3 x 1.5 x 0.55 ? rohs compliant benefits ? high esd robustness of the equipment ? suitable for high density boards complies with following standards ? mil-std 883g method 3015-7 class 3b: ?8 kv ? iec 61000-4-2 level 4: ? 8 kv (contact discharge) ? 15 kv (air discharge) applications the HSP061-8M16 is designed to protect against electrostatic discharge on sub micron technology circuits driving: ? hdmi 1.3 and 1.4 ? digital video interface ? display port ? serial ata figure 1. functional schematic (top view) description the HSP061-8M16 is an 8-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultra-low variation of the capacitance ensures very low influence on signal-skew. the large bandwidth and the low reflection make it compatible with 3.4 gbps. the device is packaged in qfn-16l with a 400 m pitch, which minimizes the pcb area. qfn-16l in 1 in 2 in 3 in 4 in 5 in 6 in 7 in 8 out 1 out 2 out 3 out 4 out 5 out 6 out 7 out 8 gnd on tab 1 2 4 5 6 3 7 8 16 15 13 12 14 10 9 11 www.st.com
characteristics HSP061-8M16 2/10 docid18055 rev 3 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage (1) iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 20 kv i pp repetitive peak pulse current (8/20 s) 3 a t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c 1. measurements done on iec 61000-4-2 test bench. for further details see application note an3353. table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 100 na v cl clamping voltage iec 61000-4-2, +8 kv contact (i pp = 30 a), measured at 30 ns 14 v c i/o - gnd capacitance (input/output to ground) v i/o = 0 v f = 200 to 3000 mhz, v osc = 30 mv 0.6 0.8 pf c i/o - gnd capacitance variation (input/output to ground) v i/o = 0 v f = 200 to 3000 mhz, v osc = 30 mv 0.03 0.05 pf f c cut-off frequency -3db 6.3 ghz z diff differential impedance t r = 200 ps (10 - 90%) (1) z 0 diff = 100 90 105 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office.
docid18055 rev 3 3/10 HSP061-8M16 characteristics 10 figure 2. leakage current versus junction temperature (typical values) figure 3. s21 attenuation measurement 0.1 1.0 10.0 100.0 1000.0 25 50 75 100 125 150 i r (na) v r =v rm = 3 v tj (c) db 10mhz 30mhz 100mhz 300mhz 1ghz 3ghz -8 -7 -6 -5 -4 -3 -2 -1 0 f (hz) figure 4. differential impedance (z diff ) (1) figure 5. eye diagram, hdmi mask, at 3.4 gbps per channel (1) 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office. tr = 200 ps (10% - 90%) 12.5 /div z 0diff = 100 - vertical : 200 mv / div horizontal : 50 ps / div figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 50 v / div 20 ns / div 20 gs / s 50 v / div 20 ns / div 20 gs / s
package information HSP061-8M16 4/10 docid18055 rev 3 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. qfn-16l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 3.20 3.30 3.40 0.126 0.130 0.134 d2 2.45 2.60 2.70 0.096 0.102 0.106 e 1.40 1.50 1.60 0.055 0.059 0.063 e2 0.20 0.35 0.45 0.008 0.014 0.018 e 0.40 0.016 k 0.20 0.008 l 0.20 0.30 0.40 0.008 0.012 0.016 figure 9. footprint recommendations (dimensions in mm) figure 10. marking d e a e d2 l b k e2 a1 index area (d/2 x e/2) exposed pad pin # 1 id 0.40 0.45 0.40 0.20 2.80 3.00 0.85 1.75 xx ww y p dot: pin 1 xx: marking ww: assembly week y: assembly year p: assembly plant
docid18055 rev 3 5/10 HSP061-8M16 package information 10 figure 11. qfn-16l tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 12.0 1.75 5.5 ? 1.55 0.80 1.80 0.25 3.60 xx ww yp xx ww yp xx ww yp
recommendation on pcb assembly HSP061-8M16 6/10 docid18055 rev 3 3 recommendation on pcb assembly 3.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 12. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 13. recommended stencil window position l t w aspect ratio w t ----- 1,5 = aspect area lw 2t l w + () --------------------------- - 0,66 = 200 m 450 m 422 m 192 m 14 m 14 m 4m 4m 2800 m 400 m 2000 m 280 m 400 m 400 m 60 m 60 m footprint stencil window footprint t=100 m
docid18055 rev 3 7/10 HSP061-8M16 recommendation on pcb assembly 10 3.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 3.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead rec ognition capabilities of th e placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks a nd open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly HSP061-8M16 8/10 docid18055 rev 3 3.5 reflow profile figure 14. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
docid18055 rev 3 9/10 HSP061-8M16 ordering information 10 4 ordering information figure 15. ordering information scheme 5 revision history table 3. ordering information order code marking package weight base qty delivery mode HSP061-8M16 hd qfn-16l 12 mg 3000 tape and reel (7?) hsp 06 1 - 8 m16 high speed line protection breakdown voltage version number of lines package qfn-16l table 4. document revision history date revision changes 19-nov-2010 1 initial release. 05-may-2011 2 updated air discharge value and added footnote in table 1 . 03-apr-2014 3 reformatted to current standard.
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